View MTP2P50E_1285858.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

MTP2P50E
Preferred Device
Power MOSFET 2 Amps, 500 Volts
P-Channel TO-220
This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltage-blocking capability without degrading performance over time. In addition, this Power MOSFET is designed to withstand high energy in the avalanche and commutation modes. The energy efficient design also offers a drain-to-source diode with a fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients. * Robust High Voltage Termination * Avalanche Energy Specified * Source-to-Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode * Diode is Characterized for Use in Bridge Circuits * IDSS and VDS(on) Specified at Elevated Temperature
MAXIMUM RATINGS (TC = 25C unless otherwise noted)
Rating Drain-Source Voltage Drain-Gate Voltage (RGS = 1.0 M) Gate-Source Voltage - Continuous - Non-Repetitive (tp 10 ms) Drain Current - Continuous Drain Current - Continuous @ 100C Drain Current - Single Pulse (tp 10 s) Total Power Dissipation Derate above 25C Operating and Storage Temperature Range Single Pulse Drain-to-Source Avalanche Energy - Starting TJ = 25C (VDD = 100 Vdc, VGS = 10 Vdc, IL = 4.0 Apk, L = 10 mH, RG = 25 ) Thermal Resistance - Junction to Case - Junction to Ambient Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds Symbol VDSS VDGR VGS VGSM ID ID IDM PD TJ, Tstg EAS Value 500 500 20 40 2.0 1.6 6.0 75 0.6 -55 to 150 80 Unit Vdc 4 Vdc Vdc Vpk Adc Apk 1 Watts W/C C mJ MTP2P50E LL Y WW 2 3
http://onsemi.com
2 AMPERES 500 VOLTS RDS(on) = 6
P-Channel D
G S
MARKING DIAGRAM & PIN ASSIGNMENT
4 Drain
TO-220AB CASE 221A STYLE 5
MTP2P50E LLYWW 3 Source 2 Drain
1 Gate
= Device Code = Location Code = Year = Work Week
C/W RJC RJA TL 1.67 62.5 260 C
ORDERING INFORMATION
Device MTP2P50E Package TO-220AB Shipping 50 Units/Rail
Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 2000
1
November, 2000 - Rev. 3
Publication Order Number: MTP2P50E/D
MTP2P50E
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Drain-Source Breakdown Voltage (VGS = 0 Vdc, ID = 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current (VDS = 500 Vdc, VGS = 0 Vdc) (VDS = 500 Vdc, VGS = 0 Vdc, TJ = 125C) Gate-Body Leakage Current (VGS = 20 Vdc, VDS = 0) ON CHARACTERISTICS (Note 1.) Gate Threshold Voltage (VDS = VGS, ID = 250 Adc) Temperature Coefficient (Negative) Static Drain-Source On-Resistance (VGS = 10 Vdc, ID = 1.0 Adc) Drain-Source On-Voltage (VGS = 10 Vdc) (ID = 2.0 Adc) (ID = 1.0 Adc, TJ = 125C) Forward Transconductance (VDS = 15 Vdc, ID = 1.0 Adc) DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance SWITCHING CHARACTERISTICS (Note 2.) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Gate Charge (See Figure 8) (S Fi (VDS = 400 Vdc, ID = 2.0 Adc, VGS = 10 Vdc) (VDD = 250 Vdc, ID = 2.0 Adc, VGS = 10 Vdc, Vdc RG = 9.1 ) td(on) tr td(off) tf QT Q1 Q2 Q3 SOURCE-DRAIN DIODE CHARACTERISTICS Forward On-Voltage (Note 1.) (IS = 2.0 Adc, VGS = 0 Vdc) (IS = 2.0 Adc, VGS = 0 Vdc, TJ = 125C) VSD - - trr (IS = 2.0 Adc, VGS = 0 Vdc, 2 0 Adc Vdc dIS/dt = 100 A/s) Reverse Recovery Stored Charge INTERNAL PACKAGE INDUCTANCE Internal Drain Inductance (Measured from contact screw on tab to center of die) (Measured from the drain lead 0.25 from package to center of die) Internal Source Inductance (Measured from the source lead 0.25 from package to source bond pad) 1. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 2. Switching characteristics are independent of operating junction temperature. LD - - LS - 3.5 4.5 7.5 - - - nH nH ta tb QRR - - - - 2.3 1.85 223 161 62 1.92 3.5 - - - - - C ns Vdc - - - - - - - - 12 14 21 19 19 3.7 7.9 9.9 24 28 42 38 27 - - - nC ns (VDS = 25 Vd VGS = 0 Vdc, Vdc, Vd f = 1.0 MHz) Ciss Coss Crss - - - 845 100 26 1183 140 52 pF VGS(th) 2.0 - RDS(on) VDS(on) - - gFS 0.5 9.5 - - 14.4 12.6 - mhos - 3.0 4.0 4.5 4.0 - 6.0 Vdc mV/C Ohm Vdc V(BR)DSS 500 - IDSS - - IGSS - - - - 10 100 100 nAdc - 564 - - Vdc mV/C Adc Symbol Min Typ Max Unit
Reverse Recovery Time (See Figure 14) (S Fi
http://onsemi.com
2
MTP2P50E
TYPICAL ELECTRICAL CHARACTERISTICS
4 3.5 I D , DRAIN CURRENT (AMPS) 3 2.5 2 1.5 1 0.5 0 0 4 8 12 16 20 5V 4 3.5 I D , DRAIN CURRENT (AMPS) 3 2.5 2 1.5 1 0.5 4V 24 28 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) 0 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7
TJ = 25C
VGS = 10 V
7V 8V 6V
VDS 10 V 100C 25C
TJ = -55C
VGS, GATE-TO-SOURCE VOLTAGE (VOLTS)
Figure 1. On-Region Characteristics
R DS(on) , DRAIN TO SOURCE RESISTANCE (OHMS) R DS(on) , DRAIN TO SOURCE RESISTANCE (OHMS)
Figure 2. Transfer Characteristics
10 8 6 4
VGS = 10 V TJ = 100C
6 5.75 5.5 5.25 5 4.75 4.5 4.25 4 0
TJ = 25C
25C
VGS = 10 V 15 V
-55C 2
0
0
0.5
1
1.5 3 2 2.5 ID, DRAIN CURRENT (AMPS)
3.5
4
0.5
1
2 3 1.5 2.5 ID, DRAIN CURRENT (AMPS)
3.5
4
Figure 3. On-Resistance versus Drain Current and Temperature
2 RDS(on), DRAIN TO SOURCE RESISTANCE (NORMALIZED) VGS = 10 V ID = 1 A 1.5 I DSS , LEAKAGE (nA) 100 1000
Figure 4. On-Resistance versus Drain Current and Gate Voltage
VGS = 0 V TJ = 125C
100C
1
10 25C
0.5 -50
-25
0
25
50
75
100
125
150
1
0
50
100
150
200
250
300
350
400
450
500
TJ, JUNCTION TEMPERATURE (C)
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
Figure 5. On-Resistance Variation with Temperature
Figure 6. Drain-To-Source Leakage Current versus Voltage
http://onsemi.com
3
MTP2P50E
POWER MOSFET SWITCHING Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (t) are determined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculating rise and fall because drain-gate capacitance varies greatly with applied voltage. Accordingly, gate charge data is used. In most cases, a satisfactory estimate of average input current (IG(AV)) can be made from a rudimentary analysis of the drive circuit so that t = Q/IG(AV) During the rise and fall time interval when switching a resistive load, VGS remains virtually constant at a level known as the plateau voltage, VSGP. Therefore, rise and fall times may be approximated by the following: tr = Q2 x RG/(VGG - VGSP) tf = Q2 x RG/VGSP where VGG = the gate drive voltage, which varies from zero to VGG RG = the gate drive resistance and Q2 and VGSP are read from the gate charge curve. During the turn-on and turn-off delay times, gate current is not constant. The simplest calculation uses appropriate values from the capacitance curves in a standard equation for voltage change in an RC network. The equations are: td(on) = RG Ciss In [VGG/(VGG - VGSP)] td(off) = RG Ciss In (VGG/VGSP)
1800 1600 1400 C, CAPACITANCE (pF) 1200 1000 800 600 400 200 0 10 5 0 Crss 5 Coss 10 15 20 25 1 10 100 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) 1000 Crss Ciss VDS = 0 V Ciss C, CAPACITANCE (pF) 100 Coss 10 Crss VGS = 0 V TJ = 25C
The capacitance (Ciss) is read from the capacitance curve at a voltage corresponding to the off-state condition when calculating td(on) and is read at a voltage corresponding to the on-state when calculating td(off). At high switching speeds, parasitic circuit elements complicate the analysis. The inductance of the MOSFET source lead, inside the package and in the circuit wiring which is common to both the drain and gate current paths, produces a voltage at the source which reduces the gate drive current. The voltage is determined by Ldi/dt, but since di/dt is a function of drain current, the mathematical solution is complex. The MOSFET output capacitance also complicates the mathematics. And finally, MOSFETs have finite internal gate resistance which effectively adds to the resistance of the driving source, but the internal resistance is difficult to measure and, consequently, is not specified. The resistive switching time variation versus gate resistance (Figure 9) shows how typical switching performance is affected by the parasitic circuit elements. If the parasitics were not present, the slope of the curves would maintain a value of unity regardless of the switching speed. The circuit used to obtain the data is constructed to minimize common inductance in the drain and gate circuit loops and is believed readily achievable with board mounted components. Most power electronic loads are inductive; the data in the figure is taken with a resistive load, which approximates an optimally snubbed inductive load. Power MOSFETs may be safely operated into an inductive load; however, snubbing reduces switching losses.
1000
VGS = 0 V TJ = 25C
Ciss
VGS VDS GATE-TO-SOURCE OR DRAIN-TO-SOURCE VOLTAGE (VOLTS)
Figure 7a. Capacitance Variation
Figure 7b. High Voltage Capacitance Variation
http://onsemi.com
4
MTP2P50E
VGS, GATE TO SOURCE VOLTAGE (VOLTS) 12 10 8 Q1 6 4 2 0 Q3 0 2 4 6 8 10 12 14 QT, TOTAL CHARGE (nC) VDS 16 18 Q2 ID = 2 A TJ = 25C 150 100 50 0 20 VGS 200 QT 300 250 1000 VDS , DRAIN TO SOURCE VOLTAGE (VOLTS) VDD = 250 V ID = 2 A VGS = 10 V TJ = 25C
t, TIME (ns)
100 tf
td(off)
tr 10 1 10
td(on) 100
RG, GATE RESISTANCE (OHMS)
Figure 8. Gate-To-Source and Drain-To-Source Voltage versus Total Charge
Figure 9. Resistive Switching Time Variation versus Gate Resistance
DRAIN-TO-SOURCE DIODE CHARACTERISTICS
2 1.6 1.2 0.8 0.4 0 0.6 VGS = 0 V TJ = 25C
I S , SOURCE CURRENT (AMPS)
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
VSD, SOURCE-TO-DRAIN VOLTAGE (VOLTS)
Figure 10. Diode Forward Voltage versus Current
SAFE OPERATING AREA The Forward Biased Safe Operating Area curves define the maximum simultaneous drain-to-source voltage and drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and a case temperature (TC) of 25C. Peak repetitive pulsed power limits are determined by using the thermal response data in conjunction with the procedures discussed in AN569, "Transient Thermal Resistance-General Data and Its Use." Switching between the off-state and the on-state may traverse any load line provided neither rated peak current (IDM) nor rated voltage (VDSS) is exceeded and the transition time (tr,tf) do not exceed 10 s. In addition the total power averaged over a complete switching cycle must not exceed (TJ(MAX) - TC)/(RJC). A Power MOSFET designated E-FET can be safely used in switching circuits with unclamped inductive loads. For reliable operation, the stored energy from circuit inductance dissipated in the transistor while in avalanche must be less than the rated limit and adjusted for operating conditions differing from those specified. Although industry practice is to rate in terms of energy, avalanche energy capability is not a constant. The energy rating decreases non-linearly with an increase of peak current in avalanche and peak junction temperature. Although many E-FETs can withstand the stress of drain-to-source avalanche at currents up to rated pulsed current (IDM), the energy rating is specified at rated continuous current (ID), in accordance with industry custom. The energy rating must be derated for temperature as shown in the accompanying graph (Figure 12). Maximum energy at currents below rated continuous ID can safely be assumed to equal the values indicated.
http://onsemi.com
5
MTP2P50E
SAFE OPERATING AREA
10 I D , DRAIN CURRENT (AMPS) 80 10 s E , SINGLE PULSE DRAIN-TO-SOURCE AS AVALANCHE ENERGY (mJ)
VGS = 20 V SINGLE PULSE TC = 25C 100 s 1 ms
ID = 2 A
60
1
40
0.1
10 ms RDS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.1 1 10 100
dc
20
0.01
1000
0
25
50
75
100
125
150
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
TJ, STARTING JUNCTION TEMPERATURE (C)
Figure 11. Maximum Rated Forward Biased Safe Operating Area
Figure 12. Maximum Avalanche Energy versus Starting Junction Temperature
1 r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE D = 0.5 0.2 0.1 0.1 0.01 0.05 0.02 t2 DUTY CYCLE, D = t1/t2 1.0E-03 1.0E-02 t, TIME (s) 1.0E-01 t1 P(pk) RJC(t) = r(t) RJC D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) RJC(t) 1.0E+00 1.0E+01
SINGLE PULSE 0.01 1.0E-05
1.0E-04
Figure 13. Thermal Response
di/dt IS trr ta tp IS tb TIME 0.25 IS
Figure 14. Diode Reverse Recovery Waveform
http://onsemi.com
6
MTP2P50E
PACKAGE DIMENSIONS
TO-220 THREE-LEAD TO-220AB CASE 221A-09 ISSUE AA
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 ----0.080 GATE DRAIN SOURCE DRAIN MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 ----2.04
-T- B
4
SEATING PLANE
F T S
C
Q
123
A U K
H Z L V G D N R J
STYLE 5: PIN 1. 2. 3. 4.
http://onsemi.com
7
MTP2P50E
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
NORTH AMERICA Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com Fax Response Line: 303-675-2167 or 800-344-3810 Toll Free USA/Canada N. American Technical Support: 800-282-9855 Toll Free USA/Canada EUROPE: LDC for ON Semiconductor - European Support German Phone: (+1) 303-308-7140 (Mon-Fri 2:30pm to 7:00pm CET) Email: ONlit-german@hibbertco.com French Phone: (+1) 303-308-7141 (Mon-Fri 2:00pm to 7:00pm CET) Email: ONlit-french@hibbertco.com English Phone: (+1) 303-308-7142 (Mon-Fri 12:00pm to 5:00pm GMT) Email: ONlit@hibbertco.com EUROPEAN TOLL-FREE ACCESS*: 00-800-4422-3781 *Available from Germany, France, Italy, UK, Ireland CENTRAL/SOUTH AMERICA: Spanish Phone: 303-308-7143 (Mon-Fri 8:00am to 5:00pm MST) Email: ONlit-spanish@hibbertco.com Toll-Free from Mexico: Dial 01-800-288-2872 for Access - then Dial 866-297-9322 ASIA/PACIFIC: LDC for ON Semiconductor - Asia Support Phone: 303-675-2121 (Tue-Fri 9:00am to 1:00pm, Hong Kong Time) Toll Free from Hong Kong & Singapore: 001-800-4422-3781 Email: ONlit-asia@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
http://onsemi.com
8
MTP2P50E/D

▲Up To Search▲

Price & Availability of MTP2P50E

	To Download MTP2P50E Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .